A Review of Traditional Helical to Recent Miniaturized Printed Circuit Board Rogowski Coils for Power-Electronic Applications

被引:75
作者
Shi, Yafei [1 ]
Xin, Zhen [1 ]
Loh, Poh Chiang [2 ]
Blaabjerg, Frede [3 ]
机构
[1] Hebei Univ Technol, State Key Lab EERI, Tianjin 300130, Peoples R China
[2] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Peoples R China
[3] Aalborg Univ, Dept Energy Technol, DK-9220 Aalborg, Denmark
基金
中国国家自然科学基金;
关键词
Coils; Current measurement; Bandwidth; Windings; Skeleton; Semiconductor device measurement; Power electronics; Current sensor; printed circuit board (PCB); Rogowski coil; wide-bandgap semiconductor; wide bandwidth; FAULT-DIAGNOSIS; DESIGN; SENSOR; TRANSDUCER;
D O I
10.1109/TPEL.2020.2984055
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Latest wide-bandgap power devices are switching progressively faster compared with existing silicon devices. Their accurate current measurements for either control or protection have therefore become tougher. One method that can fulfill the requirements is to use a Rogowski coil and its accompanied electronics to form a Rogowski current sensor with high bandwidth, small volume, low cost, and ease of integration. This article therefore aims to review various aspects of the Rogowski current sensor from its history, measuring principles to modern power-electronic applications. The applications have, in turn, motivated a progression from traditional helical to recent miniaturized printed circuit board implementation, in order to improve the overall power density. This progression has similarly been reviewed, together with its various design aspects applied to the winding, integrator, shielding, and parameters of the Rogowski current sensor. Future challenges and directions are then summarized, whose ultimate goal is to maximize accuracy over a wide bandwidth without being affected by radiated and near-field-coupling interferences.
引用
收藏
页码:12207 / 12222
页数:16
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