Gallium-based thermal interface material with high compliance and wettability

被引：138

作者：

Gao, Yunxia ^{[1
]}

Liu, Jing ^{[1
]}

机构：

[1] Chinese Acad Sci, Tech Inst Phys & Chem, Beijing 100190, Peoples R China

来源：

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2012年 / 107卷 / 03期

关键词：

CARBON NANOTUBE ARRAYS; CONTACT RESISTANCE; MANAGEMENT;

D O I：

10.1007/s00339-012-6887-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This study reports a gallium-based thermal interface material (GBTIM) consisting of gallium oxides dispersed uniformly into the 99 % gallium metal. The wettability of GBTIM with other materials is disclosed and compared. The thermal conductivity of GBTIM measured by a computer-controlled Mathis TCi thermal analyzer is similar to 13.07 W m(-1) K-1 at room temperature, which is significantly higher than that of conventional thermal greases. An experimental facility is described to measure the thermal resistance across the GBTIM under steady-state conditions and the thermal interface resistance is measured as low as 2.6 mm(2) kW(-1) with a pressure of 0.05 MPa, which is an order lower than that of the best commercialized thermal greases. Further, the GBTIM is formed into a desired shape to enhance thermal transfer, such as semi-liquid paste or thermal pad, which can be cut into a required shape.

引用

页码：701 / 708

页数：8

共 25 条

[1]

Booth R. B., 1992, U.S. Patent, Patent No. [5.198.189, 5198189]

[2]

Cha G., 2010, ASME INT MECH ENG C, V12, P927

[3] Improvement of thermal contact resistance by carbon nanotubes and nanofibers [J].

Chuang, HF ;

Cooper, SM ;

Meyyappan, M ;

Cruden, BA .

JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2004, 4 (08) :964-967

[4] Thermal interface materials [J].

Chung, DDL .

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2001, 10 (01) :56-59

[5] Photoacoustic characterization of carbon nanotube array thermal interfaces [J].

Cola, Baratunde A. ;

Xu, Jun ;

Cheng, Changrui ;

Xu, Xianfan ;

Fisher, Timothy S. ;

Hu, Hanping .

JOURNAL OF APPLIED PHYSICS, 2007, 101 (05)

[6] Increased real contact in thermal interfaces: A carbon nanotube/foil material [J].

Cola, Baratunde A. ;

Xu, Xianfan ;

Fisher, Timothy S. .

APPLIED PHYSICS LETTERS, 2007, 90 (09)

[7] Hybrid liquid metal-water cooling system for heat dissipation of high power density microdevices [J].

Deng, Yueguang ;

Liu, Jing .

HEAT AND MASS TRANSFER, 2010, 46 (11-12) :1327-1334

[8]

Donald J., 2006, P 33 INT S COMP ARCH, V78

[9] Enhanced thermoelectric cooling at cold junction interfaces [J].

Ghoshal, U ;

Ghoshal, S ;

McDowell, C ;

Shi, L ;

Cordes, S ;

Farinelli, M .

APPLIED PHYSICS LETTERS, 2002, 80 (16) :3006-3008

[10] The effect of thermal contact resistance on heat management in the electronic packaging [J].

Grujicic, M ;

Zhao, CL ;

Dusel, EC .

APPLIED SURFACE SCIENCE, 2005, 246 (1-3) :290-302

← 1 2 3 →