Reliability Study of Low Cost Alternative Ag Bonding Wire with Various Bond Pad Materials

被引：39

作者：

Yoo, Kyung-Ah ^{[1
]}

Uhm, Chul ^{[1
]}

Kwon, Tae-Jin ^{[1
]}

Cho, Jong-Soo ^{[1
]}

Moon, Jeong-Tak ^{[1
]}

机构：

[1] MK Electron Co Ltd, Yongin 449812, Gyeonggi Do, South Korea

来源：

2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009) | 2009年

关键词：

D O I：

10.1109/EPTC.2009.5416424

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

There have been many studies on replacing Au bonding wire with other bonding wire materials, because the cost of Au has dramatically increased by approximately 2 similar to 3 times in recent years. When replacing part of the bond pad with a noble metal, Ag bonding wire is of particular interest due to its superior electrical properties, lower cost and similar mechanical properties as compared with Au. Ag bonding wire is thermosonically bonded to 3 kinds of bond pad (Al, Au and Pd) and aged at high temperature (175 degrees C). Then, the bondability and interface reactions are characterized at each bond pad. In the case of Ag-Al bonding, 2 kinds of intermediate phases were observed and the composition ratios of Ag and Al in these phases were 4:1 and 2:1, respectively. After 300 hrs of aging, cracks were formed in these intermediate phases and ball-lift failure occurred. However, in the case of the noble metal bond pad, a solid solution was formed between the Ag wire and bond pad and no voids or cracks were formed. This shows the robust bonding characteristics. The diffusion layer was observed and the diffraction pattern was analyzed by TEM (Transmission Electron microscopy). The Au-Al bond reliability was also characterized by a comparative study. In this study, Ag bonding wire is proposed as an alternative to Au bonding wire for noble metal pads. Also, the thermal reliability is reviewed and the failure mechanisms are verified with various bond pads.

引用

页码：851 / 857

页数：7

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