Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

被引：32

作者：

Togasaki, N

Okinaka, Y

Homma, T

Osaka, T ^{[1
]}

机构：

[1] Waseda Univ, Dept Appl Chem, Shinjuku Ku, Tokyo 1698555, Japan

[2] Waseda Univ, Adv Res Inst Sci & Engn, Shinjuku Ku, Tokyo 1698555, Japan

来源：

ELECTROCHIMICA ACTA | 2005年 / 51卷 / 05期

关键词：

amorphous gold-nickel alloy; nickel-tungsten alloy; hardness; resistivity; contact resistance;

D O I：

10.1016/j.electacta.2005.04.057

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material. (C) 2005 Elsevier Ltd. All rights reserved.

引用

页码：882 / 887

页数：6

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