Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

被引：13

作者：

de la Broise, Xavier ^{[1
]}

Le Coguie, Alain ^{[1
]}

Sauvageot, Jean-Luc ^{[1
]}

Pigot, Claude ^{[1
]}

Coppolani, Xavier ^{[1
]}

Moreau, Vincent ^{[1
]}

d'Hollosy, Samuel ^{[2
]}

Knarosovski, Timur ^{[2
]}

Engel, Andreas ^{[2
]}

机构：

[1] Univ Paris Saclay, CEA, IRFU, F-91191 Gif Sur Yvette, France

[2] Hightec MC AG, Lenzburg, Switzerland

来源：

JOURNAL OF LOW TEMPERATURE PHYSICS | 2018年 / 193卷 / 3-4期

基金：

欧盟地平线“2020”;

关键词：

Superconducting flexible PCB; Cryo-electronics; Cryogenics;

D O I：

10.1007/s10909-018-1930-3

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 mu m wide, 20 mu m spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

引用

页码：578 / 584

页数：7

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