Alumina based low permittivity substrate utilizing superplastically foaming method

被引:5
作者
Wakiyama, Miyo [1 ]
Hayashi, Hidetaka [1 ]
Kishimoto, Akira [1 ]
机构
[1] Okayama Univ, Div Mol & Mat Sci, Grad Sch Nat Sci & Technol, Kita Ku, Okayama 7008530, Japan
关键词
Alumina; Dielectric constant; Closed pore; Superplasticity; Humidity; ELECTRICAL-PROPERTIES; CERAMIC FOAMS; ZIRCONIA; FILMS; FABRICATION;
D O I
10.2109/jcersj2.118.1090
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Alumina based closed pore dominated substrates have been fabricated by using superplastically foaming method developed by our group. Co-dispersing of magnesium aluminate spinel (Spinel) and zirconia without dopant (0YZ) provided adequate superplastisity to alumina matrix, while individual dispersion of spinel or zirconia resulted in only small deformation. The dielectric constant of superplastically foamed alumina decreased monotonically with porosity. Introduced pores were all closed nature at least up to 30% of porosity, at that porosity the permittivity became half as that of full dense one. Effect of the sweating water or ambient humidity has been proved to be identical to those of full dense one, which is favorable for semiconductor substrate. (C)2010 The Ceramic Society of Japan. All rights reserved.
引用
收藏
页码:1090 / 1093
页数:4
相关论文
共 25 条
  • [1] Morphology and properties of low dielectric constant polymeric films with electrophoresis induced gradient close-pore distribution
    Chang, Chi-Jung
    Wu, Maw-Song
    Kao, Pei-Chun
    [J]. MICROPOROUS AND MESOPOROUS MATERIALS, 2008, 111 (1-3) : 267 - 275
  • [2] Properties and thermal stability of porous organic low-dielectric-constant materials
    Chang, SY
    Jang, SM
    Lin, SH
    Liang, MS
    [J]. THIN SOLID FILMS, 2004, 466 (1-2) : 54 - 61
  • [3] *CHEM SOC JAP, 2004, HDB CHEM BAS 2, P619
  • [4] Hanao M., 2008, J JPN SOC POWDER POW, V54, P732
  • [5] HASHIDA Y, 2007, J JPN SOC POWDER POW, V54, P740
  • [6] Effect of additives on the pore evolution of zirconia based ceramic foams after sintering
    Higashiwada, Tsuyoshi
    Asaoka, Hiroshi
    Hayashi, Hidetaka
    Kishimoto, Akira
    [J]. JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2007, 27 (05) : 2217 - 2222
  • [7] Removal of moisture contamination from porous polymeric low-k dielectric films
    Iqbal, A
    Juneja, H
    Yao, JP
    Shadman, F
    [J]. AICHE JOURNAL, 2006, 52 (04) : 1586 - 1593
  • [8] Superplasticity in alumina enhanced by co-dispersion of 10% zirconia and 10% spinel particles
    Kim, BN
    Hiraga, K
    Morita, K
    Sakka, Y
    [J]. ACTA MATERIALIA, 2001, 49 (05) : 887 - 895
  • [9] Electrical characterization of low-k films with nano-pore structure prepared with DMDMOS/O2 precursors
    Kim, Chang Young
    Navamathavan, R.
    Lee, Heon Ju
    Choi, Chi Kyu
    [J]. SURFACE & COATINGS TECHNOLOGY, 2008, 202 (22-23) : 5688 - 5692
  • [10] Properties of low dielectric constant fluorinated silicon oxide films prepared by plasma enhanced chemical vapor deposition
    Kim, K
    Kwon, D
    Lee, GS
    [J]. THIN SOLID FILMS, 1998, 332 (1-2) : 369 - 374