Phase-field study of IMC growth in Sn-Cu/Cu solder joints including elastoplastic effects

被引：35
作者：
Durga, A. [1 ,2 ]
Wollants, P. [1 ]
Moelans, N. [1 ]
机构：
[1] Katholieke Univ Leuven, Dept Mat Engn, Fac Engn, Kasteelpk Arenberg 44 Bus 2450, BE-3001 Leuven, Belgium
[2] KTH Royal Inst Technol, Dept Mat Sci & Engn, Brinellvagen 23, S-10044 Stockholm, Sweden
来源：
ACTA MATERIALIA | 2020年 / 188卷
基金：
欧洲研究理事会;
关键词：
Phase-field modelling; Lead-free solders; Microstructure; Deformation; ab initio calculations; INITIO MOLECULAR-DYNAMICS; TOTAL-ENERGY CALCULATIONS; INTERMETALLIC COMPOUNDS; ORIENTATION RELATIONSHIPS; MICROSTRUCTURE EVOLUTION; ELASTIC-CONSTANTS; MODEL; CU6SN5; CU3SN; DEFORMATION;
D O I：
10.1016/j.actamat.2020.01.052
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this article, we aim to study the problem of the growth of intermetallic phases in solder joints undergoing mechanical deformation, using a phase-field model for multi-phase systems that can treat diffusion, elastic and plastic deformation. A suitable model is formulated and applied to Sn-Cu/Cu lead-free solder joints. The growth of the intermetallic layers during solid-state annealing is simulated for different strain states. We assess the values of stiffness tensors available in literature and perform ab initio calculations to support the selection of reasonable values from literature. We also perform a parametric study with different eigenstrain values and applied strains. We find that there is a significant effect of the considered eigenstrains and applied strains on the growth kinetics of the system and parabolic growth kinetics is followed in cases where the intermetallic layers grow. We thereby establish the importance of strain in the growth of intermetallic layers and the need for more targeted experiments on the role of strain in the reliability of the solder joint. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：241 / 258
页数：18
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