Simulation of piezoresistive micro accelerometers' thermal cycling response

被引：0

作者：

Zhu Ping ^{[1
]}

Yang Wei ^{[1
]}

Liu XuDong ^{[1
]}

机构：

[1] N Univ China, Key Lab Instrumentat Sci & Dynam Measurement, Dept Elect Sci & Technol, Minist Educ, Taiyuan 030051, Shanxi, Peoples R China

来源：

ISTM/2007: 7TH INTERNATIONAL SYMPOSIUM ON TEST AND MEASUREMENT, VOLS 1-7, CONFERENCE PROCEEDINGS | 2007年

关键词：

thermal cycling; thermomechanical behavior; simulation;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The difference in the substrate thickness between MEMS and micro-electronics applications leads to quite different behavior during thermomechanical loading. In the paper, by ansys, we simulated thermomechanical. behavior of piezoresistive micro accelerometers' in thermal cycling. The structure deforms in a non-linear manner, displacement and stress gradients compared to microelectronics when the temperature continually increases. The purpose of this simulation is to design functional and reliable multi-layer MEMS structures.

引用

页码：5061 / 5063

页数：3