TSP Cover Glass Grinding Process Development

被引:0
作者
Song, Jai-Chul [1 ]
Yoo, Bong-sun [1 ]
机构
[1] Induk Univ, Dept Informat Commun, Seoul, South Korea
来源
2015 8TH INTERNATIONAL CONGRESS ON IMAGE AND SIGNAL PROCESSING (CISP) | 2015年
关键词
Image Processing; Cover Glass; Grinding; BM;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We developed large-area reinforcing TSP(Touch Screen Panel) Cover Glass Edge Grinding Process. This process is developed under the research focusing on the technology troubling in the original Cover Glass Grinding Process, and we improved productivity and processing quality. In the development process, we developed a complete process technology through the creation and operation of a demonstration unit. With this cover glass grinding development, we could secure process technology, image processing technology, organization mechanisms and control algorithms.
引用
收藏
页码:393 / 397
页数:5
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