490 mA/mm drain current and 1.9 V threshold voltage enhancement-mode p-GaN HEMTs and high-temperature characteristics

被引:5
作者
Liu, Kai [1 ,2 ]
Wang, Chong [1 ,2 ]
Zheng, Xuefeng [1 ,2 ]
Ma, Xiaohua [1 ,2 ]
Huang, Zeyang [1 ,2 ]
He, Yunlong [1 ,2 ]
Li, Ang [1 ,2 ]
Zhao, Yaopeng [1 ,2 ]
Mao, Wei [1 ,2 ]
Hao, Yue [1 ,2 ]
机构
[1] Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Peoples R China
[2] Xidian Univ, Sch Microelect, 2 Taibai South Rd, Xian 710071, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
AlGaN; GaN; HEMT; P-GaN cap layer; Post gate annealing; High-temperature characteristics; GATE INJECTION TRANSISTOR; ALGAN/GAN HEMTS; DEPLETION MODE; PLASMA; DAMAGE; PERFORMANCE; SUBSTRATE; METAL;
D O I
10.1016/j.sse.2021.108109
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, enhancement-mode AlGaN/GaN p-type GaN cap layer high electron mobility transistors (p-GaN HEMTs) with Ti/Au gate metal are fabricated and electrically characterized. The post gate annealing (PGA) treatment at 300 degrees C for 10 min is utilized to improve the devices' characteristics. As a result, the p-GaN HEMTs achieve a high drain current (IDS) of 490 mA/mm at VGS = 7 V with a high threshold voltage (VTH) of 1.9 V. Meanwhile, the pulse measurements show good dynamic characteristics, and the temperature-dependent characteristics indicate that the VTH has excellent high-temperature stability from 25 degrees C to 175 degrees C. Besides, it can be found that the temperature will affect the capacitance-voltage (C-V) and transconductance curves, which is related to the hole energy and electron mobility at different temperatures.
引用
收藏
页数:5
相关论文
共 25 条
[21]   Gate injection transistor (GIT) - A normally-off AlGaN/GaN power transistor using conductivity modulation [J].
Uemoto, Yasuhiro ;
Hikita, Masahiro ;
Ueno, Hiroaki ;
Matsuo, Hisayoshi ;
Ishida, Hidetoshi ;
Yanagihara, Manabu ;
Ueda, Tetsuzo ;
Tanaka, Tsuyoshi ;
Ueda, Daisuke .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (12) :3393-3399
[22]   High-temperature modeling of AlGaN/GaN HEMTs [J].
Vitanov, S. ;
Palankovski, V. ;
Maroldt, S. ;
Quay, R. .
SOLID-STATE ELECTRONICS, 2010, 54 (10) :1105-1112
[23]   823-mA/mm Drain Current Density and 945-MW/cm2 Baliga's Figure-of-Merit Enhancement-Mode GaN MISFETs With a Novel PEALD-AlN/LPCVD-Si3N4 Dual-Gate Dielectric [J].
Wang, Hongyue ;
Wang, Jinyan ;
Li, Mengjun ;
Cao, Qirui ;
Yu, Min ;
He, Yandong ;
Wu, Wengang .
IEEE ELECTRON DEVICE LETTERS, 2018, 39 (12) :1888-1891
[24]   AlGaN-Channel Gate Injection Transistor on Silicon Substrate With Adjustable 4-7-V Threshold Voltage and 1.3-kV Breakdown Voltage [J].
Zhang, Li ;
Zhou, Hong ;
Zhang, Weihang ;
Dang, Kui ;
Zhang, Tao ;
Ma, Peijun ;
Ma, Xiaohua ;
Zhang, Jincheng .
IEEE ELECTRON DEVICE LETTERS, 2018, 39 (07) :1026-1029
[25]   Improved Interface and Transport Properties of AlGaN/GaN MIS-HEMTs With PEALD-Grown AlN Gate Dielectric [J].
Zhu, Jie-Jie ;
Ma, Xiao-Hua ;
Xie, Yong ;
Hou, Bin ;
Chen, Wei-Wei ;
Zhang, Jin-Cheng ;
Hao, Yue .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (02) :512-518