490 mA/mm drain current and 1.9 V threshold voltage enhancement-mode p-GaN HEMTs and high-temperature characteristics

被引:5
作者
Liu, Kai [1 ,2 ]
Wang, Chong [1 ,2 ]
Zheng, Xuefeng [1 ,2 ]
Ma, Xiaohua [1 ,2 ]
Huang, Zeyang [1 ,2 ]
He, Yunlong [1 ,2 ]
Li, Ang [1 ,2 ]
Zhao, Yaopeng [1 ,2 ]
Mao, Wei [1 ,2 ]
Hao, Yue [1 ,2 ]
机构
[1] Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Peoples R China
[2] Xidian Univ, Sch Microelect, 2 Taibai South Rd, Xian 710071, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
AlGaN; GaN; HEMT; P-GaN cap layer; Post gate annealing; High-temperature characteristics; GATE INJECTION TRANSISTOR; ALGAN/GAN HEMTS; DEPLETION MODE; PLASMA; DAMAGE; PERFORMANCE; SUBSTRATE; METAL;
D O I
10.1016/j.sse.2021.108109
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, enhancement-mode AlGaN/GaN p-type GaN cap layer high electron mobility transistors (p-GaN HEMTs) with Ti/Au gate metal are fabricated and electrically characterized. The post gate annealing (PGA) treatment at 300 degrees C for 10 min is utilized to improve the devices' characteristics. As a result, the p-GaN HEMTs achieve a high drain current (IDS) of 490 mA/mm at VGS = 7 V with a high threshold voltage (VTH) of 1.9 V. Meanwhile, the pulse measurements show good dynamic characteristics, and the temperature-dependent characteristics indicate that the VTH has excellent high-temperature stability from 25 degrees C to 175 degrees C. Besides, it can be found that the temperature will affect the capacitance-voltage (C-V) and transconductance curves, which is related to the hole energy and electron mobility at different temperatures.
引用
收藏
页数:5
相关论文
共 25 条
[1]   Origin of etch delay time in Cl2 dry etching of AlGaN/GaN structures [J].
Buttari, D ;
Chini, A ;
Palacios, T ;
Coffie, R ;
Shen, L ;
Xing, H ;
Heikman, S ;
McCarthy, L ;
Chakraborty, A ;
Keller, S ;
Mishra, UK .
APPLIED PHYSICS LETTERS, 2003, 83 (23) :4779-4781
[2]   Control of threshold voltage of AlGaN/GaN HEMTs by fluoride-based plasma treatment: From depletion mode to enhancement mode [J].
Cai, Yong ;
Zhou, Yugang ;
Lau, Kei May ;
Chen, Kevin J. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (09) :2207-2215
[3]   Depth and thermal stability of dry etch damage in GaN Schottky diodes [J].
Cao, XA ;
Cho, H ;
Pearton, SJ ;
Dang, GT ;
Zhang, AP ;
Ren, F ;
Shul, RJ ;
Zhang, L ;
Hickman, R ;
Van Hove, JM .
APPLIED PHYSICS LETTERS, 1999, 75 (02) :232-234
[4]   On the physical operation and optimization of the p-GaN gate in normally-off GaN HEMT devices [J].
Efthymiou, L. ;
Longobardi, G. ;
Camuso, G. ;
Chien, T. ;
Chen, M. ;
Udrea, F. .
APPLIED PHYSICS LETTERS, 2017, 110 (12)
[5]   Plasma-etching-enhanced deep centers in n-GaN grown by metalorganic chemical-vapor deposition [J].
Fang, ZQ ;
Look, DC ;
Wang, XL ;
Han, J ;
Khan, FA ;
Adesida, I .
APPLIED PHYSICS LETTERS, 2003, 82 (10) :1562-1564
[6]   Effects of Annealing Treatments on the Properties of Al/Ti/p-GaN Interfaces for Normally OFF p-GaN HEMTs [J].
Greco, Giuseppe ;
Iucolano, Ferdinando ;
Di Franco, Salvatore ;
Bongiorno, Corrado ;
Patti, Alfonso ;
Roccaforte, Fabrizio .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (07) :2735-2741
[7]   Breakdown Enhancement and Current Collapse Suppression by High-Resistivity GaN Cap Layer in Normally-Off AlGaN/GaN HEMTs [J].
Hao, Ronghui ;
Li, Weiyi ;
Fu, Kai ;
Yu, Guohao ;
Song, Liang ;
Yuan, Jie ;
Li, Junshuai ;
Deng, Xuguang ;
Zhang, Xiaodong ;
Zhou, Qi ;
Fan, Yaming ;
Shi, Wenhua ;
Cai, Yong ;
Zhang, Xinping ;
Zhang, Baoshun .
IEEE ELECTRON DEVICE LETTERS, 2017, 38 (11) :1567-1570
[8]   Normally-off p-GaN/AlGaN/GaN high electron mobility transistors using hydrogen plasma treatment [J].
Hao, Ronghui ;
Fu, Kai ;
Yu, Guohao ;
Li, Weiyi ;
Yuan, Jie ;
Song, Liang ;
Zhang, Zhili ;
Sun, Shichuang ;
Li, Xiajun ;
Cai, Yong ;
Zhang, Xinping ;
Zhang, Baoshun .
APPLIED PHYSICS LETTERS, 2016, 109 (15)
[9]   Source-Connected p-GaN Gate HEMTs for Increased Threshold Voltage [J].
Hwang, Injun ;
Oh, Jaejoon ;
Choi, Hyuk Soon ;
Kim, Jongseob ;
Choi, Hyoji ;
Kim, Joonyong ;
Chong, Soogine ;
Shin, Jaikwang ;
Chung, U-In .
IEEE ELECTRON DEVICE LETTERS, 2013, 34 (05) :605-607
[10]   p-GaN Gate HEMTs With Tungsten Gate Metal for High Threshold Voltage and Low Gate Current [J].
Hwang, Injun ;
Kim, Jongseob ;
Choi, Hyuk Soon ;
Choi, Hyoji ;
Lee, Jaewon ;
Kim, Kyung Yeon ;
Park, Jong-Bong ;
Lee, Jae Cheol ;
Ha, Jongbong ;
Oh, Jaejoon ;
Shin, Jaikwang ;
Chung, U-In .
IEEE ELECTRON DEVICE LETTERS, 2013, 34 (02) :202-204