490 mA/mm drain current and 1.9 V threshold voltage enhancement-mode p-GaN HEMTs and high-temperature characteristics

被引:5
作者
Liu, Kai [1 ,2 ]
Wang, Chong [1 ,2 ]
Zheng, Xuefeng [1 ,2 ]
Ma, Xiaohua [1 ,2 ]
Huang, Zeyang [1 ,2 ]
He, Yunlong [1 ,2 ]
Li, Ang [1 ,2 ]
Zhao, Yaopeng [1 ,2 ]
Mao, Wei [1 ,2 ]
Hao, Yue [1 ,2 ]
机构
[1] Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Peoples R China
[2] Xidian Univ, Sch Microelect, 2 Taibai South Rd, Xian 710071, Peoples R China
基金
中国博士后科学基金; 中国国家自然科学基金;
关键词
AlGaN; GaN; HEMT; P-GaN cap layer; Post gate annealing; High-temperature characteristics; GATE INJECTION TRANSISTOR; ALGAN/GAN HEMTS; DEPLETION MODE; PLASMA; DAMAGE; PERFORMANCE; SUBSTRATE; METAL;
D O I
10.1016/j.sse.2021.108109
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, enhancement-mode AlGaN/GaN p-type GaN cap layer high electron mobility transistors (p-GaN HEMTs) with Ti/Au gate metal are fabricated and electrically characterized. The post gate annealing (PGA) treatment at 300 degrees C for 10 min is utilized to improve the devices' characteristics. As a result, the p-GaN HEMTs achieve a high drain current (IDS) of 490 mA/mm at VGS = 7 V with a high threshold voltage (VTH) of 1.9 V. Meanwhile, the pulse measurements show good dynamic characteristics, and the temperature-dependent characteristics indicate that the VTH has excellent high-temperature stability from 25 degrees C to 175 degrees C. Besides, it can be found that the temperature will affect the capacitance-voltage (C-V) and transconductance curves, which is related to the hole energy and electron mobility at different temperatures.
引用
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页数:5
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