Efficient, tunable flip-chip-integrated III-V/Si hybrid external-cavity laser array

被引:46
作者
Lin, Shiyun [1 ]
Zheng, Xuezhe [1 ]
Yao, Jin [1 ]
Djordjevic, Stevan S. [1 ]
Cunningham, John E. [1 ]
Lee, Jin-Hyoung [1 ]
Shubin, Ivan [1 ]
Luo, Ying [1 ]
Bovington, Jock [1 ]
Lee, Daniel Y. [1 ]
Thacker, Hiren D. [1 ]
Raj, Kannan [1 ]
Krishnamoorthy, Ashok V. [1 ]
机构
[1] Oracle Networking Grp, 9515 Towne Ctr Dr, San Diego, CA 92121 USA
关键词
SILICON; POWER; COMPACT;
D O I
10.1364/OE.24.021454
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
We demonstrate a surface-normal coupled tunable hybrid silicon laser array for the first time using passively-aligned, high-accuracy flip chip bonding. A 2x6 III-V reflective semiconductor optical amplifier (RSOA) array with integrated total internal reflection mirrors is bonded to a CMOS SOI chip with grating couplers and silicon ring reflectors to form a tunable hybrid external-cavity laser array. Waveguide-coupled wall plug efficiency (wcWPE) of 2% and output power of 3 mW has been achieved for all 12 lasers. We further improved the performance by reducing the thickness of metal/dielectric stacks and achieved 10mW output power and 5% wcWPE with the same integration techniques. This non-invasive, one-step back end of the line (BEOL) integration approach provides a promising solution to high density laser sources for future large-scale photonic integrated circuits. (C) 2016 Optical Society of America
引用
收藏
页码:21454 / 21462
页数:9
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