Selective ablation of thin SiO2 layers on silicon substrates by femto- and picosecond laser pulses

被引:25
作者
Rublack, T. [1 ]
Hartnauer, S. [1 ]
Kappe, P. [2 ]
Swiatkowski, C. [2 ]
Seifert, G. [1 ]
机构
[1] Univ Halle Wittenberg, Inst Phys, D-06120 Halle, Germany
[2] Q Cells SE, D-06766 Bitterfeld, Germany
来源
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2011年 / 103卷 / 01期
关键词
FEMTOSECOND; DYNAMICS;
D O I
10.1007/s00339-011-6352-x
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The selective ablation of thin (similar to 100 nm) SiO2 layers from silicon wafers has been investigated by applying ultra-short laser pulses at a wavelength of 800 nm with pulse durations in the range from 50 to 2000 fs. We found a strong, monotonic decrease of the laser fluence needed for complete ablation of the dielectric layer with decreasing pulse duration. The threshold fluence for 100% ablation probability decreased from 750 mJ/cm(2) at 2 ps to 480 mJ/cm(2) at 50 fs. Significant corruption of the opened Si surface has been observed above similar to 1200 mJ/cm(2), independent of pulse duration. By a detailed analysis of the experimental series the values for melting and breaking thresholds are obtained; the physical mechanisms responsible for the significant dependence on the laser pulse duration are discussed.
引用
收藏
页码:43 / 50
页数:8
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