Exact analysis of the wire-bonded multiconductor transmission line

被引：8
作者：
Page, Juan E. [1 ]
Marquez-Segura, Enrique
Casares-Miranda, Francisco P.
Esteban, Jaime
Otero, Pablo
Camacho-Penalosa, Carlos
机构：
[1] Univ Politecn Madrid, Dept Electromagnetismo & Teoria Circuitos, Escuela Tecn Super Ingn Telecommun, E-28040 Madrid, Spain
[2] Univ Malaga, Dept Ingn Commun, Escuela Tecn Super Ingn Telecommun, E-29071 Malaga, Spain
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2007年 / 55卷 / 08期
关键词：
interdigital capacitor; microwave integrated circuits; microwave passive circuits; multiconductor transmission lines; wire-bonded interdigital capacitor; wire bonding;
D O I：
10.1109/TMTT.2007.902084
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the exact model of a multiconductor transmission line with bonding wires is presented. The model is based on the multiport admittance matrix, and is valid for any number of conductors in the structure. The model shows how to compute the two-port admittance matrix of the wire-bonded structure with direct application to the wire-bonded interdigital capacitor. The model has been validated by means of method-of-moments-based numerical simulation and by experimental work.
引用
收藏
页码：1585 / 1592
页数：8
相关论文
共 50 条
  • [21] Unified multiconductor transmission-line model of multiple-shield multiconductor cables: evaluation of shield connections performances
    Parmantier, J-p.
    Junqua, I.
    Ridel, M.
    Bertuol, S.
    ADVANCED ELECTROMAGNETICS, 2023, 12 (01) : 45 - 57
  • [22] Deep Learning Model for Capacitance and Inductance Matrices Prediction of Multiconductor Transmission Line
    Chebbi, Houssem
    Junqua, Isabelle
    Cisse, Tame
    2024 INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ELECTROMAGNETIC COMPATIBILITY, EMC EUROPE 2024, 2024, : 340 - 345
  • [23] COMPARISON OF EXACT ANALYSIS AND STEPLINES APPROXIMATION FOR EXTERNALLY EXCITED EXPONENTIAL TRANSMISSION LINE
    Cheldavi, Ahmad
    INTERNATIONAL JOURNAL OF ENGINEERING, 2005, 18 (01): : 11 - 20
  • [24] Multiconductor Transmission Line Modeling of Crosstalk Between Cables in the Presence of Composite Ground Planes
    Rotgerink, Jesper Lansink
    Serra, Ramiro
    Leferink, Frank
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2021, 63 (04) : 1231 - 1239
  • [25] Investigation of the longitudinal multiconductor transmission line functions for symmetric coupled-microstrip systems
    Nickel, JG
    Schutt-Ainé, JE
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2002, 50 (01) : 183 - 190
  • [26] Transmission of the maximum number of signals through a multiconductor transmission line without crosstalk or return loss: theory and simulation
    Vulfin, Vladimir
    Ianconescu, Reuven
    IET MICROWAVES ANTENNAS & PROPAGATION, 2015, 9 (13) : 1444 - 1452
  • [27] Sensitivity Analysis of Lossy Nonuniform Multiconductor Transmission Lines With Nonlinear Terminations
    Dou, Lei
    Dou, Jiao
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2010, 33 (02): : 492 - 497
  • [28] Fast transient analysis of incident field coupling to multiconductor transmission lines
    Shinh, GS
    Nakhla, NM
    Achar, R
    Nakhla, MS
    Dounavis, A
    Erdin, I
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2006, 48 (01) : 57 - 73
  • [29] A Fast Frequency-Domain Method for Lossless Multiconductor Transmission Line Equations and Its Application
    Xiao, Fei
    2010 ASIA-PACIFIC MICROWAVE CONFERENCE, 2010, : 610 - 613
  • [30] TRANSMISSION ELECTRON-MICROSCOPY OF AU-AL WIRE BONDED INTERFACE
    HAJI, H
    MIYOSHI, K
    MORITA, T
    NAKASHIMA, H
    YOSHINAGA, H
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1992, 56 (04) : 355 - 360
12345