Exact analysis of the wire-bonded multiconductor transmission line

被引：8
|
作者：
Page, Juan E. [1 ]
Marquez-Segura, Enrique
Casares-Miranda, Francisco P.
Esteban, Jaime
Otero, Pablo
Camacho-Penalosa, Carlos
机构：
[1] Univ Politecn Madrid, Dept Electromagnetismo & Teoria Circuitos, Escuela Tecn Super Ingn Telecommun, E-28040 Madrid, Spain
[2] Univ Malaga, Dept Ingn Commun, Escuela Tecn Super Ingn Telecommun, E-29071 Malaga, Spain
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2007年 / 55卷 / 08期
关键词：
interdigital capacitor; microwave integrated circuits; microwave passive circuits; multiconductor transmission lines; wire-bonded interdigital capacitor; wire bonding;
D O I：
10.1109/TMTT.2007.902084
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the exact model of a multiconductor transmission line with bonding wires is presented. The model is based on the multiport admittance matrix, and is valid for any number of conductors in the structure. The model shows how to compute the two-port admittance matrix of the wire-bonded structure with direct application to the wire-bonded interdigital capacitor. The model has been validated by means of method-of-moments-based numerical simulation and by experimental work.
引用
收藏
页码：1585 / 1592
页数：8
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