1.3 mu m InGaP/InAsP MQW lasers with large spot-size and low loss fibre chip coupling fabricated by a standard buried heterostructure process

被引:7
作者
Bouadma, N
Ougazzaden, A
Kamoun, M
Kazmierski, C
Silvestre, L
机构
[1] France Telecom/CNET/PAB, 92225 Bagneux Cedex
关键词
semiconductor junction lasers; semiconductor quantum wells; optical couplers;
D O I
10.1049/el:19961086
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
1.3 mu m large spot-size laser diodes without a mode converter fabricated by conventional buried heterostructure laser process, and using MQW core structure with low effective refractive index are demonstrated, The devices show low coupling losses to cleaved fibre, good alignment tolerances, and high temperature characteristics.
引用
收藏
页码:1582 / 1583
页数:2
相关论文
共 6 条
[1]   OVER 245-MW 1.3-MU-M BURIED RIDGE STRIPE LASER-DIODES ON NORMAL-SUBSTRATE FABRICATED BY THE REACTIVE ION-BEAM ETCHING TECHNIQUE [J].
BOUADMA, N ;
KAZMIERSKI, C ;
SEMO, J .
APPLIED PHYSICS LETTERS, 1991, 59 (01) :22-24
[2]  
FUKANO H, 1995, P 21 EUR C OPT COMM, P1027
[3]   INGAASP/INP TAPERED ACTIVE LAYER MULTIQUANTUM-WELL LASER WITH 1.8-DB COUPLING LOSS TO CLEAVED SINGLEMODE FIBER [J].
LEALMAN, IF ;
RIVERS, LJ ;
HARLOW, MJ ;
PERRIN, SD .
ELECTRONICS LETTERS, 1994, 30 (20) :1685-1687
[4]   MONOLITHIC INTEGRATION OF A SPOT SIZE TRANSFORMER WITH A PLANAR BURIED HETEROSTRUCTURE IN GAASP/INP-LASER USING THE SHADOW MASKED GROWTH TECHNIQUE [J].
MOERMAN, I ;
DHONDT, M ;
VANDERBAUWHEDE, W ;
COUDENYS, G ;
HAES, J ;
DEDOBBELAERE, P ;
BAETS, R ;
VANDAELE, P ;
DEMEESTER, P .
IEEE PHOTONICS TECHNOLOGY LETTERS, 1994, 6 (08) :888-890
[5]   HIGH-TEMPERATURE CHARACTERISTIC T-O AND LOW-THRESHOLD CURRENT-DENSITY OF 1.3 MU-M INASP/INGAP/INP COMPENSATED STRAIN MULTIQUANTUM-WELL STRUCTURE LASERS [J].
OUGAZZADEN, A ;
MIRCEA, A ;
KAZMIERSKI, C .
ELECTRONICS LETTERS, 1995, 31 (10) :803-805
[6]   High temperature operation of 1.3 mu m narrow beam divergence tapered-thickness waveguide BH MQW lasers [J].
Yamamoto, T ;
Kobayashi, H ;
Ekawa, M ;
Fujii, T ;
Soda, H ;
Kobayashi, M .
ELECTRONICS LETTERS, 1995, 31 (25) :2178-2179