Preparation and properties of DMC/MVQ composites

被引:0
作者
Wu Weili [1 ]
Feng Yunsheng [1 ]
机构
[1] Qiqihar Univ, Coll Chem & Engn, Qiqihar 161006, Peoples R China
来源
PROCEEDINGS OF 2009 INTERNATIONAL CONFERENCE ON ADVANCED FIBERS AND POLYMER MATERIALS, VOLS 1 AND 2 | 2009年
关键词
dough-molding compound; silicon rubber; silica; composites; properties;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Methyl vinyl silicon rubber (MVQ) composites reinforced with dough-molding compound (DMC) and filled with silica were prepared by blending method. The influences of silica and DMC content, and cure condition on the mechanical and thermal properties of the composites were investigated. The compatibility and cross-linking construction of composites were respectively studied by SEM and Fourier transform infrared spectroscopy (FTIR). The results showed that DMC/MVQ composites have the better mechanical and thermal properties when the formulation of the compound was MVQ 100, DMC 70 and silica 35 phr, and the cure conditions are 170 degrees C for 30min under 10MPa. The compatibility of DMC/MVQ composites is better than pure DMC. The C-O-C bond between UP in DMC and MVQ is formed by FTIR analysis, and the mechanical and thermal properties of DMC/MVQ are obviously improved.
引用
收藏
页码:532 / 535
页数:4
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