Effect of sputtering-cleaning on adhesion of the metallic films to polymer substrates

被引：25

作者：

Fujinami, Y ^{[1
]}

Hayashi, H ^{[1
]}

Ebe, A ^{[1
]}

Imai, O ^{[1
]}

Ogata, K ^{[1
]}

机构：

[1] Nissin Elect, R&D Div, Ukyo Ku, Kyoto 615, Japan

来源：

MATERIALS CHEMISTRY AND PHYSICS | 1998年 / 54卷 / 1-3期

关键词：

adhesion; polyethylene; polytetrafluoroethylene; titanium; ion irradiation; chemical bending;

D O I：

10.1016/S0254-0584(98)00094-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effect of sputtering-cleaning on adhesion and chemical bonding at the metal/polymer interface was studied. Titanium (Ti) films were deposited on polymer substrates, polyethylene and polytetrafluoroethylene (PTFE) after sputtering-cleaning treatment. The sputtering-cleaning treatment consisted of argon ion irradiation at 0.3 keV. Adhesion was measured by a pull test, and the chemical bonding at the interface was investigated by X-ray photoelectron spectroscopy. Adhesion of both polymer substrates was improved by sputtering-cleaning In the case of PE, the ratio of C-Ti bonding at the interface increased after sputtering-cleaning and resulted in adhesion improvement. C-Ti and F-Ti bonding appeared at the interface between the Ti film and the PTFE substrate, but improvement in adhesion of Ti/PTFE was attributed to the change of the interfacial morphology on the basis of the scanning electron spectroscopy observation and adhesion of Au to PTFE. (C) 1998 Elsevier Science S.A. All rights reserved.

引用

页码：102 / 105

页数：4

共 6 条

[1] ADHESION OF EVAPORATED TITANIUM FILMS TO ION-BOMBARDED POLYETHYLENE [J].