Experimental study of dye penetration in plastic encapsulated microcircuit

被引：0

作者：

Gai, Hongxing ^{[1
]}

Wang, Jing ^{[1
]}

Chen, Shixin ^{[1
]}

Ren, Xiang ^{[1
]}

Gao, Li ^{[1
]}

机构：

[1] China Elect Standardized Inst, Ctr Destruct Phys Anal, Beijing 100007, Peoples R China

来源：

ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2007年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A potential reliability problem in plastic encapsulated microcircuits (PEMs) is moisture absorption and chemical ingress, which caused by the micro-crack or delamination of lead frame in the device. This paper describes the fluorescent dye penetration experimental setup that is used to reveals the leak pathways or the micro-crack in the PEM device. The visual evidence of the suspected defect can be seen by fluorescence under ultraviolet light. Experimental results are then presented, which show that the penetrant got into the inside of the sample only along the interface between the different materials. It indicates that the fluorescence dye penetration experiment is efficient in the detection of the delamination and cavity for the PEMS.

引用

页码：774 / 776

页数：3