Effect of growth rate on microstructure parameters and microhardness in directionally solidified Ti-49Al alloy

被引：40
作者：
Fan, Jianglei [1 ]
Li, Xinzhong [1 ]
Su, Yanqing [1 ]
Guo, Jingjie [1 ]
Fu, Hengzhi [1 ]
机构：
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
来源：
MATERIALS & DESIGN | 2012年 / 34卷
基金：
美国国家科学基金会;
关键词：
A; Intermetallics; C; Casting; E; Microhardness; TEMPERATURE-GRADIENT; PROCESSING PARAMETERS; SI ALLOYS; DEPENDENCY; SPACINGS;
D O I：
10.1016/j.matdes.2011.05.007
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Intermetallics Ti-49Al (at.%) alloy was directionally solidified with different growth rates (V = 5 mu m/s-30 mu m/s) at a constant temperature gradient (G = 12.1 K/mm) by using a Bridgman type directional solidification furnace. The primary dendritic spacing (lambda), interlamellar spacing (lambda(L)), and microhardness (HV) were measured. Effect of V on HV, lambda and lambda(L) was experimental investigated. The dependencies of lambda, lambda(L) and HV on the growth rate were determined by using linear regressing analysis. According to the result, the values of lambda and lambda(L) decrease with the increasing of V. and the values of HV increase with the increasing of V and with the decreasing of,. and L. The results were compared with previous similar experimental results for TiAl-based alloys. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码：552 / 558
页数：7
相关论文
共 37 条
  • [1] Effect of growth rate and Mg content on dendrite tip characteristics of Al-Cu-Mg ternary alloys
    Berkdemir, A.
    Gunduz, M.
    [J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2009, 96 (04): : 873 - 886
  • [2] Bouchard D., 1997, METALL MATER TRANS B, V28, P633
  • [3] Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder
    Boyuk, U.
    Marasli, N.
    [J]. MATERIALS CHEMISTRY AND PHYSICS, 2010, 119 (03) : 442 - 448
  • [4] The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy
    Boyuk, U.
    Marasli, N.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 485 (1-2) : 264 - 269
  • [5] Directional solidification of Al-Cu-Ag alloy
    Boyuk, U.
    Marasli, N.
    Kaya, H.
    Cadirli, E.
    Keslioglu, K.
    [J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2009, 95 (03): : 923 - 932
  • [6] Effect of growth rates and temperature gradients on the lamellar spacing and the undercooling in the directionally solidified Pb-Cd eutectic alloy
    Çadirli, E
    Kaya, H
    Gündüz, M
    [J]. MATERIALS RESEARCH BULLETIN, 2003, 38 (9-10) : 1457 - 1476
  • [7] The dependence of lamellar spacing on growth rate and temperature gradient in the lead-tin eutectic alloy
    Çadirli, E
    Gündüz, M
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2000, 97 (1-3) : 74 - 81
  • [8] Materials microhardness "finger prints"
    Christodoulou, Periklis
    Garbiak, Malgorzata
    Piekarski, Bogdan
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 457 (1-2): : 350 - 367
  • [9] Clemens H, 2000, ADV ENG MATER, V2, P551, DOI 10.1002/1527-2648(200009)2:9<551::AID-ADEM551>3.0.CO
  • [10] 2-U
1234