Proximity effect of neighbour victim lossy interconnects on a single attacker and vice versa

被引：2

作者：

Ponchel, F. ^{[1
]}

Legier, J. F. ^{[1
]}

Paleczny, E. ^{[1
]}

Seguinot, C. ^{[1
]}

Deschacht, D. ^{[2
]}

机构：

[1] CNRS, IEMN, UMR 8520, Av Poincare,BP 60069, F-59652 Villeneuve Dascq, France

[2] LIRMM, Montpellier 5, France

来源：

2007 INTERNATIONAL SYMPOSIUM ON INTEGRATED CIRCUITS, VOLS 1 AND 2 | 2007年

关键词：

D O I：

10.1109/ISICIR.2007.4441884

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Signal integrity on a set from three to eight lossy copper interconnects of less than one square micron is determined from a transient simulation based on electrical circuit representation. This circuit is deduced from a full wave finite element method. Our signal integrity results on numerous possible excitations show that two neighbour interconnects on both sides of a reference aggressor or victim is sufficient to predict more complex situation on largest number of wires. This means that the five interconnects case is also well appropriate. We have verified that it is the best compromise whatever the permittivity of dielectric material which filled the spacing between interconnects, as well as the width of this spacing.

引用

页码：406 / +

页数：2

共 10 条

[1] The highlights in the nano world [J].

Chang, CY .

PROCEEDINGS OF THE IEEE, 2003, 91 (11) :1756-1764

[2] Compact distributed RLC interconnect models - Part II: Coupled line transient expressions and peak crosstalk in multilevel networks [J].

Davis, JA ;

Meindl, JD .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 2000, 47 (11) :2078-2087

[3] Interconnect limits on gigascale integration (GSI) in the 21st century [J].

Davis, JA ;

Venkatesan, R ;

Kaloyeros, A ;

Beylansky, M ;

Souri, SJ ;

Banerjee, K ;

Saraswat, KC ;

Rahman, A ;

Reif, R ;

Meindl, JD .

PROCEEDINGS OF THE IEEE, 2001, 89 (03) :305-324

[4]

DAVIS JA, 2000, IEEE T EDUC, V45, P580

[5] Crosstalk in product related bus systems using 110 nm CMOS technology [J].

Ktata, MF ;

Grabinski, H ;

Arz, U ;

Fischer, H .

SIGNAL PROPAGATION ON INTERCONNECTS, PROCEEDINGS, 2004, :85-88

[6] FULL-WAVE ANALYSIS OF DIELECTRIC WAVE-GUIDES USING TANGENTIAL VECTOR FINITE-ELEMENTS [J].

LEE, JF ;

SUN, DK ;

CENDES, ZJ .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1991, 39 (08) :1262-1271

[7] Interconnect opportunities for gigascale integration [J].

Meindl, JD ;

Davis, JA ;

Zarkesh-Ha, P ;

Patel, CS ;

Martin, KP ;

Kohl, PA .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2002, 46 (2-3) :245-263

[8]

PONCHEL F, 2007, THESIS U LILLE

[9] COMPUTATION OF CHARACTERISTIC IMPEDANCE FOR MULTIPLE MICROSTRIP TRANSMISSION-LINES USING A VECTOR FINITE-ELEMENT METHOD [J].

SLADE, GW ;

WEBB, KJ .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1992, 40 (01) :34-40

[10]

SLADE GW, 1989, IEEE T MAGN, V25, P2947

← 1 →