Modeling, measurement, and simulation of simultaneous switching noise

被引:48
作者
McCredie, BD [1 ]
Becker, WD [1 ]
机构
[1] IBM CORP,POUGHKEEPSIE,NY 12601
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1996年 / 19卷 / 03期
关键词
D O I
10.1109/96.533884
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The computer package designer depends on modeling power supply noises to ensure that system designs will function properly. Power supply noises can have a tremendous effect on system operation and performance, The circuit simulation of a system power distribution is very challenging since it requires accurate models of active devices, passive components, transmission lines, and a very large power distribution network. This paper presents the development of a high-frequency power distribution model for the simulation of simultaneous switching noise of a complementary metal-oxide-semiconductor (CMOS) chip on a multilayered ceramic substrate. Measurements are performed on a CMOS chip with simultaneously switching off-chip drivers (OCD's), The modeling approach is validated by the excellent agreement between the measurement waveforms and simulation results.
引用
收藏
页码:461 / 472
页数:12
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