Full-Wave Analysis of Power Distribution Networks in Printed Circuit Boards

被引:2
作者
Maradei, Francescaromana [1 ]
Caniggia, Spartaco [2 ]
Inverardi, Nicola [3 ]
Rotigni, Mario [4 ]
机构
[1] Sapienza Univ, Dept Elect Engn, I-00184 Rome, Italy
[2] EMC Consultant, I-20010 Bareggio, MI, Italy
[3] EURO Instruments, I-25032 Chiari, BS, Italy
[4] STMicroelect, I-20041 Agrate Brianza, Italy
关键词
decoupling capacitor; integrated circuits (ICs); power distribution network (PDN); printed circuit board (PCB); radiated and conducted emission; SPICE circuit simulator; PLANES;
D O I
10.1587/transcom.E93.B.1670
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper provides an investigation of power distribution network (PDN) performance by a full-wave prediction tool and by experimental measurements. A set of six real boards characterized by increasing complexity is considered in order to establish a solid base for behaviour understanding of printed circuit boards. How the growing complexity impacts on the board performance is investigated by measurements and by simulations. Strengths and weakness of PDN modeling by the full-wave software tool Microwave Studio are highlighted and discussed.
引用
收藏
页码:1670 / 1677
页数:8
相关论文
共 14 条
  • [1] Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique
    Archambeault, B
    Ruehli, AE
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2001, 43 (04) : 437 - 445
  • [2] Caniggia S, 1996, IEEE 1996 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - EMC: SILICON TO SYSTEMS, SYMPOSIUM RECORD, P316, DOI 10.1109/ISEMC.1996.561250
  • [3] Caniggia S., 2008, Signal Integrity and Radiated Emission of High-Speed Digital Systems
  • [4] CANIGGIA S, 1996, IEEE 1996 INT S EL C, P436
  • [5] [陈西战 CHEN Xizhan], 2007, [火工品, Initiators & Pyrotechnics], P1
  • [6] Hall S. H., 2000, High-Speed Digital SystemDesign: A Handbook of Interconnect Theory and Design Practices
  • [7] POWER BUS DECOUPLING ON MULTILAYER PRINTED-CIRCUIT BOARDS
    HUBING, TH
    DREWNIAK, JL
    VANDOREN, TP
    HOCKANSON, DM
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1995, 37 (02) : 155 - 166
  • [8] *IEC, 619672 IEC
  • [9] Modeling of multilayered power distribution planes using transmission matrix method
    Kim, JH
    Swaminathan, M
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (02): : 189 - 199
  • [10] Knighten J., 2005, IEEE EMC SOC NEWSLET, V207, P34