Heterogeneous Chip Integration Process for Flexible Wireless Microsystem Application

被引：5

作者：

Chao, Tzu-Yuan ^{[1
,2
]}

Liang, Chia-Wei ^{[1
,2
]}

Cheng, Y. T. ^{[1
,2
]}

Kuo, Chien-Nan ^{[1
,2
]}

机构：

[1] Natl Chiao Tung Univ, Dept Elect Engn, Microsyst Integrat Lab, Hsinchu 300, Taiwan

[2] Natl Chiao Tung Univ, Inst Elect, Hsinchu 300, Taiwan

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 2011年 / 58卷 / 03期

关键词：

Au-Au thermocompressive (TC) bonding; bumpless interconnecting; flexible electronics; flip-chip; heterogeneous chip integration; surface cleaning; RING OSCILLATORS; FLIP-CHIP;

D O I：

10.1109/TED.2010.2102357

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a low-cost heterogeneous integration technology combining the previously developed bumpless radio-frequency (RF) system-on-a-package scheme with a special surface cleaning process to assemble a complementary metal-oxide-semiconductor chip with an organic substrate (SU-8/polydimethylsiloxane) by low-temperature Au-Au thermocompressive bonds (< 200 degrees C) for flexible wireless microsystem fabrication. The RF performance of -15 dB return loss and -0.25 dB insertion loss at 40 GHz and above 6 MPa bonding strength of a microstrip-to-coplanar-waveguide interconnect transition between the chip and the substrate make the technology practical for flexible wireless microsystem integration.

引用

页码：906 / 909

页数：4

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