Extreme negative rake angle technique for single point diamond nano-cutting of silicon

被引：36

作者：

Patten, JA ^{[1
]}

Gao, W

机构：

[1] Univ N Carolina, Charlotte, NC 28223 USA

[2] Tohoku Univ, Sendai, Miyagi 980, Japan

来源：

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY | 2001年 / 25卷 / 02期

关键词：

single point diamond machining; silicon; ductile; tool geometry; rake angle;

D O I：

10.1016/S0141-6359(00)00072-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Experiments were conducted to evaluate cuts made with the rake face of the tool and the clearance face. The technique involved cutting in the corresponding opposite directions, i.e., forward with the rake face and backward with the clearance face. Cutting of single crystal silicon with both the rake and the clearance face resulted in a smooth ductile cut, with no evidence of fracture. This cutting technique may prove useful for furthering our understanding of the ductile machining of brittle materials. (C) 2001 Elsevier Science Inc. All rights reserved.

引用

页码：165 / 167

页数：3