BiCMOS thermal sensor circuit for built-in test purposes

被引：5
作者：
Altet, J
Rubio, A
Dilhaire, S
Schaub, E
Claeys, W
机构：
[1] Univ Politecn Cataluna, Dept Elect Engn, E-08034 Barcelona, Spain
[2] Univ Bordeaux 1, Ctr Phys Mol Opt & Hertzienne, F-33405 Talence, France
来源：
ELECTRONICS LETTERS | 1998年 / 34卷 / 13期
关键词：
D O I：
10.1049/el:19980947
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
New difficulties have arisen in integrated circuit (IC) testing due to trends in technological development. Alternatives to traditional circuit testing techniques are appearing, such as thermal testing. The authors present a new built-in IC-surface differential thermal sensor. The sensor, analysis, implementation on a BiCMOS specific integrated circuit, and experimental measurements show the viability of temperature sensing for testing purposes.
引用
收藏
页码：1307 / 1309
页数：3
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