共 11 条
- [1] Bunnoon P., 2013, INT J ELECTR COMPUT, V3, P553, DOI DOI 10.11591/IJECE.V3I4.3195
- [3] Dae-Woo Choi, 2011, [Journal of Korean Institute of Information Technology, 한국정보기술학회논문지], V9, P1
- [6] Reliability and failure mode of chip-on-film with non-conductive adhesive [J]. PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 157 - 160
- [7] Janghee Lee, 2010, Journal of KISS: Software and Applications, V37, P386
- [8] Kim Jin-soo, 2013, [Journal of the Korea Institute Of Information and Communication Engineering, 한국정보통신학회논문지], V17, P1899, DOI 10.6109/jkiice.2013.17.8.1899
- [9] Kreyszig E., 1985, ADV ENG MATH, P818