Innovations in Terahertz Interconnects

被引：0
|
作者：
Holloway, Jack W. [1 ]
Dogiamis, Georgios C. [2 ]
Han, Ruonan [1 ]
机构：
[1] MIT, Cambridge, MA 02139 USA
[2] Intel Corp, Components Res, Santa Clara, CA USA
来源：
IEEE MICROWAVE MAGAZINE | 2020年 / 21卷 / 01期
关键词：
WAVE-GUIDE; COMMUNICATION LINK; DESIGN; CIRCUITS;
D O I：
10.1109/MMM.2019.2945139
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The continued increase in computing capability that has occurred through the technology scaling foretold by Moore [1] and Dennard et al. [2] has led to a commensurate increase in the input-output requirements of computing systems. This phenomenon has been most significantly experienced in terms of the interconnect technologies in large data centers (DCs) and high-performance computing (HPC) applications. Historical data have shown a two to three times increase in aggregate data rates every two years [3]. This space covers a variety of different interconnect length scales. In a comprehensive survey by Thraskias et al. [4], high-speed interconnects are grouped according to the following taxonomy.
引用
收藏
页码：35 / 50
页数：16
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