Backside probing of flip-chip circuits using electrostatic force sampling

被引：0

作者：

Qi, R ^{[1
]}

Thomson, DJ ^{[1
]}

Bridges, GE ^{[1
]}

机构：

[1] Micron Force Instruments Inc, San Jose, CA 95112 USA

来源：

1999 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 37TH ANNUAL | 1999年

关键词：

D O I：

10.1109/RELPHY.1999.761636

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

We present a non-contact probing technique for measuring high-frequency voltage waveforms from the backside of a flip-chip mounted integrated circuit. The signals are accessed by mechanical thinning and focused ion beam milling through the backside. Internal circuit voltages are measured by sensing the local electrostatic force on a small micromachined probe that is held in close proximity to the circuit measurement point. The instrument currently has a 3 GHz bandwidth and a capacitive loading on the test point of less than 1 fF The output waveforms from ring oscillator flip-chip test circuits are presented.

引用

页码：337 / 340

页数：4

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