Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

被引：69
作者：
Hu, F. Q. [1 ]
Zhang, Q. K. [1 ]
Jiang, J. J. [1 ]
Song, Z. L. [1 ]
机构：
[1] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China
来源：
MATERIALS LETTERS | 2018年 / 214卷
关键词：
SnBi solder; Bi segregation; Ag addition; Interfacial embrittlement; Deformation and fracture; Interface; MECHANICAL-PROPERTIES; ALLOYING SUBSTRATE; TENSILE PROPERTIES; BI SEGREGATION; JOINTS; EMBRITTLEMENT; TEMPERATURE; MELT;
D O I：
10.1016/j.matlet.2017.11.127
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction and fracture behavior of the aged SnBiAg/Cu solder joints were investigated. The results reveal that the Ag element in the solder can diffuse into the Cu substrate during the soldering and aging process, forming a Cu-Ag alloy layer around the joint interface. The Bi segregation was not observed at the aged SnBiAg/Cu interface, and the embrittlement will not occur at the aged SnBiAg/Cu solder joints once the Bi segregation was restrained. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码：142 / 145
页数：4
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