Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

被引：70

作者：

Hu, F. Q. ^{[1
]}

Zhang, Q. K. ^{[1
]}

Jiang, J. J. ^{[1
]}

Song, Z. L. ^{[1
]}

机构：

[1] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China

来源：

MATERIALS LETTERS | 2018年 / 214卷

关键词：

SnBi solder; Bi segregation; Ag addition; Interfacial embrittlement; Deformation and fracture; Interface; MECHANICAL-PROPERTIES; ALLOYING SUBSTRATE; TENSILE PROPERTIES; BI SEGREGATION; JOINTS; EMBRITTLEMENT; TEMPERATURE; MELT;

D O I：

10.1016/j.matlet.2017.11.127

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction and fracture behavior of the aged SnBiAg/Cu solder joints were investigated. The results reveal that the Ag element in the solder can diffuse into the Cu substrate during the soldering and aging process, forming a Cu-Ag alloy layer around the joint interface. The Bi segregation was not observed at the aged SnBiAg/Cu interface, and the embrittlement will not occur at the aged SnBiAg/Cu solder joints once the Bi segregation was restrained. (C) 2017 Elsevier B.V. All rights reserved.

引用

页码：142 / 145

页数：4

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