Millimeter-Wave Antenna-in-Package Design Validation Solution in Wireless Communication Applications

In this paper, the 2 by 2 mmWave AiP array is design in organic substrate using fcCSP structure. The RF die is placed on bottom side of organic substrate and the AiP array is put in the front side of organic substrate. Through 3D electromagnetic solver, the single AiP has good bandwidth with over 6dBi antenna gain. In design stage, the spherical chamber is utilized to validate single antenna performance. It can directly probe by RF probe on C4 bump pad or micro bump pad to get 2D or 3D radiation pattern of single antenna. From the simulation and measurement results, there is a good correlation. In engineering stage, the RF die is mounted on the bottom of organic substrate. The AiP device can utilize the compact antenna test range (CATR) chamber to get all relative radiation patterns, such as 2D/3D pattern and EIRP. Of course, the CART is a good validation solution for beamforming measurement. Finally, for mass production, a measurement test set is announced for mmWave AiP or SiP production test. Through the three different measurement solutions and mmWave measurement flow, a completed mmWave AiP and SiP flow from design to validation is delivered.