Application of single pan thermal analysis to Cu-Sn peritectic alloys

被引：42

作者：

Kohler, F. ^{[1
]}

Campanella, T. ^{[1
,2
]}

Nakamshi, S. ^{[1
]}

Rappaz, M. ^{[1
]}

机构：

[1] Ecole Polytech Fed Lausanne, Computat Mat Lab, CH-1015 Lausanne, Switzerland

[2] Rolex, Geneva, Switzerland

来源：

ACTA MATERIALIA | 2008年 / 56卷 / 07期

关键词：

thermal analysis; peritectic solidification; copper alloys; thermodynamics;

D O I：

10.1016/j.actamat.2007.12.006

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Single pan thermal analyses (SPTA) have been performed on Cu-14.5 wt.% Sn, Cu-21.3 wt.% Sri and Cu-26.8 wt.% Sit peritectic alloys. For this purpose, a SPTA assembly has been built and calibrated. As the latent heat is a function of temperature and composition during solidification of alloys, a new heat flow model coupled to a Cu-Sn thermodynamic database has been defined for the calculation of the corresponding evolutions of the solid mass fraction, f(s)(T). To verify the accuracy of this model, a close comparison with a micro-segregation model that includes back-diffusion in the primary alpha-solid phase has also been conducted successfully. The thermal analyses have finally shown that the Cu-Sn phase diagram recently assessed in the review of Liu et al. is the most reliable. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：1519 / 1528

页数：10