Impact of tunnel etching process on electrical performances of SON devices

被引:10
作者
Caubet, V
Borel, S
Arvet, C
Bilde, J
Chanemougame, D
Monfray, S
Ranica, R
Mazoyer, P
Skotnicki, T
机构
[1] STMicroelect, F-38926 Crolles, France
[2] CEA Leti, F-38054 Grenoble, France
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2005年 / 44卷 / 7B期
关键词
isotropic etching; selectivity; Si; SiGe; electrical tests; SON; NVM;
D O I
10.1143/JJAP.44.5795
中图分类号
O59 [应用物理学];
学科分类号
摘要
The removal of a sacrificial SiGe layer by isotropic etching has been newly improved for silicon-on-nothing (SON) technology by increasing etching selectivity to the Si conduction channel. Still based on CF(4) plasma chemistry, power and pressure are adapted in order to decrease etch rate and improve SiGe:Si selectivity. Both electrical characteristics and morphological observations are used to evaluate the characteristics of this technological step in terms of selectivity and uniformity. An original nonvolatile memory (NVM) concept based on this process will illustrate the interest in such etching development.
引用
收藏
页码:5795 / 5798
页数:4
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