FEM analysis of stress and strain and evaluation on reliability of soldered CBGA joints under thermal cycling

The method on 3D FEM is used to analyze the stress and strain process of ceramic ball grid array (CB-GA) components micro-joints under thermal cycling condition. By 3D FEM numerical simulation analysis of the CB-GA components interior mechanical properties under the thermal cycling loads, stress and strain distribution of the micro-joints of three different kinds of BGA sphere diameter (0.76, 1.0, 1.3 mm) were analyzed. The micro-joints thermal fatigue life was evaluated on the basis of 3D FEM numerical simulation analysis. It is shown that the FEM is available to study the micro-joints reliability in the micro electronic packaging and to evaluate the reliability of soldered CBGA joints under thermal cycling because the simulated data are close to the experimental results.