Comparison of the Mechanical Properties of Conventional Pb-free Solders and Eutectic Sn-Bi Solder

被引：0

作者：

Hao, Qichao ^{[1
]}

Tan, Xin Fu ^{[1
]}

McDonald, Stuart D. ^{[1
]}

Sweatman, Keith ^{[1
,2
]}

Nishimura, Takatoshi ^{[2
]}

Nishimura, Tetsuro ^{[2
]}

Nogita, Kazuhiro ^{[1
]}

机构：

[1] Univ Queensland, Sch Mech & Min Engn, Nihon Super Ctr Manufacture Elect Mat NS CMEM, Brisbane, Qld 4072, Australia

[2] Nihon Super Co Ltd, Suita, Osaka 5640063, Japan

来源：

2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022) | 2022年

关键词：

Mechanical Properties; lead-free solder; Sn-Bi; ALLOYS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.

引用

页码：173 / 174

页数：2

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