Comparison of the Mechanical Properties of Conventional Pb-free Solders and Eutectic Sn-Bi Solder

被引：0
|
作者：
Hao, Qichao [1 ]
Tan, Xin Fu [1 ]
McDonald, Stuart D. [1 ]
Sweatman, Keith [1 ,2 ]
Nishimura, Takatoshi [2 ]
Nishimura, Tetsuro [2 ]
Nogita, Kazuhiro [1 ]
机构：
[1] Univ Queensland, Sch Mech & Min Engn, Nihon Super Ctr Manufacture Elect Mat NS CMEM, Brisbane, Qld 4072, Australia
[2] Nihon Super Co Ltd, Suita, Osaka 5640063, Japan
来源：
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022) | 2022年
关键词：
Mechanical Properties; lead-free solder; Sn-Bi; ALLOYS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
While solder alloys based on the Sn-Bi alloy system are suitable for low-temperature soldering applications, there are a range of considerations in terms of microstructure and mechanical properties that need to be understood. This work compares the strain-rate dependency of the mechanical properties of a eutectic Sn-Bi alloy with a range of conventional Pb-free solder alloys. Important differences which have implications for low-temperature solder alloy development are discussed.
引用
收藏
页码：173 / 174
页数：2
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