Design and Analysis of Pressure Sensor Based on MEMS Cantilever Structure and Pocket Doped DG-TFET

被引:5
作者
Rajasekhar, Katuri [1 ]
Raman, Ashish [1 ]
Kumar, Naveeen [1 ]
Singh, Sarabdeep [1 ]
Kakkar, Deepti [1 ]
机构
[1] NIT Jalandhar, Dept ECE, VLSI Design, Jalandhar 144011, Punjab, India
关键词
Double Gate Tunnel Field Effect Transistor (DG-TFET); Pressure Sensor; Micro-Electromechanical System (MEMS); FLOW SENSOR;
D O I
10.1166/jno.2018.2309
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The role of Micro-electromechanical systems (MEMS) increases in too many applications, particularly in the recent decades. MEMS became practical once they can be fabricated using semiconductor fabrication technology. Nowadays the importance of pressure sensors increases. The pressure sensor will depend on different physical properties like capacitive, magnetic, piezoelectric and piezoresistive. In this paper we propose, pressure sensor based on Micro-electromechanical systems (MEMS) based cantilever structure and pocket doped double-gate tunneling field effect transistor (DG-TFET). The proposed MEMS architecture of pressure sensor working on the principle of capacitive gate coupling and work function of gate changes because of gas molecule diffusion. Due to change in coupling capacitance, the tunneling rate will increase inside the device. Pocket in DG-TFET and cantilever structure will enhance the drain current and hence sensitivity improved. The main advantage of pocket doped DG-TFET is its compatible with CMOS fabrication technology. The pressure sensor we used here consumes <= 1 mW power and approx. 250 mu A tunneling current per nm bending of cantilever beam structure.
引用
收藏
页码:1295 / 1304
页数:10
相关论文
共 24 条
  • [1] Anuradha T., 2017, INDIAN J SCI TECHNOL, V10, DOI DOI 10.17485/ijst/2017/v10i4/110675
  • [2] Double-gate tunnel FET with high-κ gate dielectric
    Boucart, Kathy
    Mihai Ionescu, Adrian
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (07) : 1725 - 1733
  • [3] Brugger J., 1996, SENSOR ACTUAT A-PHYS, V73, P235
  • [4] Chakarov D., 2016, MECH MAT SCI ENG, V6, P158
  • [5] Chien N.D., 2016, INT C EL INF COMM DA, P1, DOI 10.1109/ELINFOCOM.2016.7562947
  • [6] Dureja A., 2016, INT RES J ENG TECHNO, V3
  • [7] Technologies for cofabricating MEMS and electronics
    Fedder, Gary K.
    Howe, Roger T.
    Liu, Tsu-Jae King
    Quevy, Emmanuel P.
    [J]. PROCEEDINGS OF THE IEEE, 2008, 96 (02) : 306 - 322
  • [8] Thermal model of thin film anemometer
    Giani, A
    Mailly, F
    Bonnot, R
    Pascal-Delannoy, F
    Foucaran, A
    Boyer, A
    [J]. MICROELECTRONICS JOURNAL, 2002, 33 (08) : 619 - 625
  • [9] Hedrich F., 2003, SENSOR ACTUAT A-PHYS, V162, P373
  • [10] Microelectromechanical systems (MEMS): fabrication, design and applications
    Judy, JW
    [J]. SMART MATERIALS AND STRUCTURES, 2001, 10 (06) : 1115 - 1134