What's in Space - Exploration and Improvement of Line/Space Defect Inspection of Fine-Pitch Redistribution Layer for Fan-Out Wafer Level Packaging

被引:0
作者
Liebens, M. [1 ]
Slabbekoorn, J. [1 ]
Miller, A. [1 ]
Beyne, E. [1 ]
Yeoh, R. [2 ]
Krah, T. [2 ]
Vangal, A. [2 ]
Hiebert, S. [2 ]
Cross, A. [2 ]
机构
[1] IMEC, Leuven, Belgium
[2] KLA Corp, Milpitas, CA USA
来源
2019 30TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2019年
关键词
redistribution layer (RDL); defect inspection; defect classification; inline metrology; 3D packaging; 3D heterogeneous integration;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Advanced wafer level packaging is moving into high volume mobile and consumer electronics markets. Drivers for new packaging and integration schemes are lower-cost processes and the high count of interconnects. The different functional parts of a high-performance package are designed with high-density interconnects requiring multiple fine-pitch redistribution layers (RDL) to route and fan-out the tight pitch interconnects to the package level. Currently, high-density fan-out packages are evolving toward 1 mu m line/space and even beyond. Reducing RDL line and space widths creates challenges for the different process steps that are used to produce RDL, therefore the need for accurate and precise inline process control. This paper will elaborate on the fundamental requirements for defectivity and metrology of fine-pitch RDL processing. Defect inspection and measurements are performed on wafers containing fine-pitch RDL. Based on the correlation between electrical yield results and inspection and measurement data, improvements for the smallest RDL line/space sizes are proposed and validated to meet the requirements for defectivity and metrology of fine-pitch RDL.
引用
收藏
页数:6
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