Ultra-high heat flux dissipation with Piranha Pin Fins

被引:72
作者
Woodcock, Corey [1 ]
Ng'oma, Chisela [1 ]
Sweet, Michael [1 ]
Wang, Yingying [2 ]
Peles, Yoav [2 ]
Plawsky, Joel [1 ]
机构
[1] Rensselaer Polytech Inst, Troy, NY 12180 USA
[2] Univ Cent Florida, Orlando, FL 32816 USA
关键词
Subcooled; Flow-boiling; Critical heat flux; CHF; Departure from nucleate boiling; DNB; Micro; Piranha; Pin-fin; Heat sink; Thermal management; Heat transfer; Integrated; Embedded; IC; Cooling; MECH-X; PPF; Reactor; PRESSURE-DROP; FLOW; MICROCHANNEL; MICROSTRUCTURES; PPF;
D O I
10.1016/j.ijheatmasstransfer.2018.09.030
中图分类号
O414.1 [热力学];
学科分类号
摘要
The Microfluidic, Extreme heat flux, CMOS compatible, Heat-exchanger (MECH-X) is an embeddable siliconbased reactor-style heat sink which has been experimentally studied by the authors. The 800 mu m thick MEMS heat sink discretizes the working fluid into stacked primary and secondary chambers to enhance phase change heat transfer. Piranha Pin-Fin (PPF) microstructures-reported previously by the authors- have been employed in the primary reaction chamber. The PPF structures vent higher-enthalpy fluid into a secondary, or booster, chamber for additional heat transfer. The MECH-X system has been shown to dissipate heat loads exceeding 10,000,000 W/m(2) with dielectric fluid HFE7000 while maintaining surface temperatures below 95 degrees C. The present work reports on flow boiling experiments performed to characterize system-level performance of the MECH-X heat sink at mass fluxes of 680, 1440, and 3350 kg/s/m(2). HFE7000 was used as a coolant at ambient lab temperature (similar to 23 degrees C) and a system pressure of 377 kPa. A 3.95 mm(2) heating element, which simulated a heat generating component, was maintained below 95 degrees C with heats loads exceeding 1 kW/cm(2). Experiments were terminated at this heat flux due to saturating a 50 V-Dc laboratory power supply. Results are also presented at a system pressure of 239 kPa, and results are compared to first generation PPF heat sinks. (C) 2018 Elsevier Ltd. All rights reserved.
引用
收藏
页码:504 / 515
页数:12
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