共 37 条
[32]
Yilong Dai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT), P343, DOI 10.1109/ICEPT.2015.7236605
[36]
Ziyang Xiu, 2005, 2005 6th International Conference on Electronics Packaging Technology (IEEE Cat. No. 05EX1194), P203, DOI 10.1109/ICEPT.2005.1564678
[37]
Advances in composite materials for thermal management in electronic packaging
[J].
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY,
1998, 50 (06)
:47-51