Ultra-Thin Chip Package (UTCP) and Stretchable Circuit Technologies for Wearable ECG System

被引：0

作者：

Sterken, Tom ^{[1
]}

Vanfleteren, Jan ^{[1
]}

Torfs, Tom ^{[1
]}

de Beeck, Maaike Op ^{[1
]}

Bossuyt, Frederick ^{[1
]}

Van Hoof, Chris ^{[1
]}

机构：

[1] IMEC, Ctr Microsyst Technol CMST, B-9052 Ghent, Belgium

来源：

2011 ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY (EMBC) | 2011年

关键词：

D O I：

暂无

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies.

引用

页码：6886 / 6889

页数：4

共 8 条

[1] ACB, ACB DES FABR PCB
[2] [Anonymous], HD4100 PROCESSGUIDE
[3] Axisa F., 2008, P 2 IEEE ESTC C ESTC
[4] Bossuyt F., 2009, P EMPC 2009 RIM IT J, P697
[5] J Vanfleteren, COMPONENTS PACKAGING, V33, P754
[6] Lenihan T., P ECTC 1996, P119
[7] Torfs T., 2009, P SMART SYST INT C B, P536
[8] A 60 μW 60 nV/√Hz readout front-end for portable biopotential acquisition systems
Yazicioglu, Refet Firat
Merken, Patrick
Puers, Robert
Van Hoof, Chris
[J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2007, 42 (05) : 1100 - 1110

← 1 →