Improvement in anti-static property and thermal conductivity of epoxy resin by doping graphene

被引:20
作者
Zhang, Jiawei [1 ]
Yao, Taiping [2 ]
Shahsavarian, Tohid [3 ]
Li, Chuanyang [3 ]
Lei, Zhipeng [4 ]
Zhang, Zhousheng [5 ]
Jia, Ruokun [6 ]
Diaham, Sombel [7 ]
机构
[1] Xian Univ Technol, Sch Elect Engn, Xian, Peoples R China
[2] Northeast Elect Power Univ, Sch Elect Engn, Jilin, Jilin, Peoples R China
[3] Univ Connecticut, Inst Mat Sci Elect & Comp Engn, Elect Insulat Res Ctr, Storrs, CT 06269 USA
[4] Univ Bologna, Dept Elect Elect & Informat Engn Guglielmo Marcon, Viale Risorgimento 2, I-40136 Bologna, Italy
[5] Shanghai Univ Elect Power, Sch Elect Engn, Changyang Rd 2588, Shanghai 200090, Peoples R China
[6] Northeast Elect Power Univ, Sch Chem Engn, Jilin, Jilin, Peoples R China
[7] Univ Toulouse, UPS, INPT, LAPLACE, 118 Route Narbonne, F-31062 Toulouse 9, France
基金
中国国家自然科学基金;
关键词
epoxy resins; charge transfer; conductivity; partial discharges; COMPOSITES; POLYMER; OXIDE;
D O I
10.1109/TDEI.2020.008620
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work investigates the effect of graphene filler in epoxy resin with the purpose of developing an improved thermally conductive epoxy encapsulation material for electronic devices. The findings in this work show that the thermal conductivity increases by a factor of about 1.6 times with 0.1 wt% loading of graphene in epoxy resin. The increase in the rate of surface charge verifies an improved anti-static property. On examining the phase resolved partial discharge patterns, it is observed that the inception voltage and the number of partial discharge pulses is lower for the filled epoxy compared to that of the neat epoxy. The increase in the rate of surface charge decay indicates an improved anti-static property. The findings in this paper provide a reference in the development of materials with improved thermal conductivity and anti-static properties for graphene/epoxy materials for use in the packaging of electronic devices.
引用
收藏
页码:542 / 548
页数:7
相关论文
共 24 条
  • [1] Chen L. X., 2014, ADV MAT RES, V936, P643
  • [2] Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive
    Eom, Yong-Sung
    Choi, Kwang-Seong
    Moon, Seok-Hwan
    Park, Jun-Hee
    Lee, Jong-Hyun
    Moon, Jong-Tae
    [J]. ETRI JOURNAL, 2011, 33 (06) : 864 - 870
  • [3] Thermal conductivity enhancement of epoxy adhesive using graphene sheets as additives
    Fu, Yuan-Xiang
    He, Zhuo-Xian
    Mo, Dong-Chuan
    Lu, Shu-Shen
    [J]. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2014, 86 : 276 - 283
  • [4] Guo WChenG., 2014, J APPL POLYM SCI, V131, DOI DOI 10.1002/APP.40565
  • [5] In Situ Polymerization of Graphene, Graphite Oxide, and Functionalized Graphite Oxide into Epoxy Resin and Comparison Study of On-the-Flame Behavior
    Guo, Yuqiang
    Bao, Chenlu
    Song, Lei
    Yuan, Bihe
    Hu, Yuan
    [J]. INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 2011, 50 (13) : 7772 - 7783
  • [6] Synthesis and characterization of a silarylene-siloxane-diacetylene polymer and its conversion to a thermosetting plastic
    Homrighausen, CL
    Keller, TM
    [J]. POLYMER, 2002, 43 (09) : 2619 - 2623
  • [7] Thermal properties of polyvinyl butyral/graphene composites as encapsulation materials for solar cells
    Huang, Xiang
    Lin, Yaxue
    Fang, Guiyin
    [J]. SOLAR ENERGY, 2018, 161 : 187 - 193
  • [8] Mechanism of bulk charging behavior of ethylene propylene rubber subjected to surface charge accumulation
    Lei, Zhipeng
    Li, Chuanyang
    Men, Rujia
    He, Jinliang
    [J]. JOURNAL OF APPLIED PHYSICS, 2018, 124 (24)
  • [9] Field-dependent charging phenomenon of HVDC spacers based on dominant charge behaviors
    Li, Chuanyang
    Lin, Chuanjie
    Chen, Geng
    Tu, Youping
    Zhou, Yao
    Li, Qi
    Zhang, Bo
    He, Jinliang
    [J]. APPLIED PHYSICS LETTERS, 2019, 114 (20)
  • [10] Measurement and simulation of partial discharge in oil impregnated pressboard with an electrical aging process
    Li, Junhao
    Si, Wenrong
    Yao, Xiu
    Li, Yanming
    [J]. MEASUREMENT SCIENCE AND TECHNOLOGY, 2009, 20 (10)