Compact conduction model of ball grid array packages

被引：2
作者：
Refai-Ahmed, G
Karimanal, KV
机构：
[1] Ceyba Inc, Ottawa, ON K2K 3K2, Canada
[2] Fluent Inc, Lebanon, NH 03766 USA
来源：
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2003年 / 26卷 / 03期
关键词：
BGA; CCM; compact modeling; die temperature; heat flow; impedance;
D O I：
10.1109/TCAPT.2003.817653
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This work focuses the application of compact conduction model (CCM) creation approach to ball grid array (BGA) packages under steady state conditions. The procedure of creating CCM from-detailed BGA model is demonstrated. The authors have imposed realistic boundary condition scenarios that are likely to test the boundary condition independence necessary fur the compact modeling approach. Results showed acceptable agreement in die temperature and heat flow predictions from simulations using detailed BGA models and their CCM equivalents.
引用
收藏
页码：610 / 615
页数：6
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