Thermal conductivity of diamond particle dispersed aluminum matrix composites fabricated in solid-liquid co-existent state by SPS

被引：57

作者：

Mizuuchi, Kiyoshi ^{[1
]}

Inoue, Kanryu ^{[2
]}

Agari, Yasuyuki ^{[1
]}

Morisada, Yoshiaki ^{[1
]}

Sugioka, Masami ^{[1
]}

Tanaka, Motohiro ^{[1
]}

Takeuchi, Takashi ^{[1
]}

Kawahara, Masakazu ^{[3
]}

Makino, Yukio ^{[4
]}

机构：

[1] Osaka Municipal Tech Res Inst, Joto Ku, Osaka 5368553, Japan

[2] Univ Washington, Seattle, WA 98195 USA

[3] SPS SYNTEX INC, Takatsu Ku, Kawasaki, Kanagawa 2130012, Japan

[4] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan

来源：

COMPOSITES PART B-ENGINEERING | 2011年 / 42卷 / 05期

关键词：

Metal-matrix composites (MMCs); Particle-reinforcement; Thermal properties; Sintering; PULSE CURRENT; MAGNETOSTRICTION; MICROSTRUCTURE; STRAIN;

D O I：

10.1016/j.compositesb.2011.03.028

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Diamond particle dispersed aluminum (Al) matrix composites were fabricated in solid-liquid coexistent state from the powder mixture of diamond, pure Al and 5056-type Al-Mg alloy by spark plasma sintering (SPS) process. Microstructures and thermal conductivities of the composites fabricated were examined. These composites can be well consolidated at 813 K for 0.6 k s and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Al matrix. The relative packing density of the diamond-Al composite fabricated was 97% or higher in a volume fraction range of diamond between 25.5 and 45.5%. The thermal conductivity of the Al matrix composite containing 45.5 vol.% diamond reached 403 W/mK, approximately 76% the theoretical thermal conductivity estimated by Maxwell-Eucken's equation. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：1029 / 1034

页数：6

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