Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film

被引:16
作者
Hu, Yu-Qun [1 ]
Zhao, Ya-Pu [1 ]
Yu, Tongxi [2 ]
机构
[1] Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China
[2] Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong, Hong Kong, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2008年 / 483-84卷
基金
中国国家自然科学基金;
关键词
anodic bonding; dendritic nanostructures; aluminum thin film; depletion layer; MEMS;
D O I
10.1016/j.msea.2006.09.155
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Anodic bonding with thin films of metal or alloy as an intermediate layer, finds increasing applications in micro/nanoelectromechanical systems. At the bonding temperature of 350 degrees C, voltage of 400 V, and 30 min duration, the anodic bonding is completed between Pyrex glass and crystalline silicon coated with an aluminum thin film with a thickness comprised between 50 and 230 nm. Sodium-depleted layers and dendritic nanostructures were observed in Pyrex 7740 glass adjacent to the bonding interface. The sodium depletion width does not increase remarkably with the thickness of aluminum film. The dendritic nanostructures result from aluminum diffusion into the Pyrex glass. This experimental research is expected to enhance the understanding of how the depletion layer and dendritic nanostructures affect the quality of anodic bonding. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:611 / 616
页数:6
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