System demonstrator for board-to-board level substrate-guided wave optoelectronic interconnections

被引：0

作者：

Han, XL ^{[1
]}

Kim, G ^{[1
]}

Gupta, H ^{[1
]}

Lipovski, GJ ^{[1
]}

Chen, RT ^{[1
]}

机构：

[1] Univ Texas, Dept Elect & Comp Engn, Microelect Res Ctr, Austin, TX 78712 USA

来源：

OPTOELECTRONIC INTERCONNECTS VIII | 2001年 / 4292卷

关键词：

substrate-guided wave; optoelectronic interconnections; centralized optical backplane;

D O I：

10.1117/12.428023

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We design and implement a system demonstrator based on vertical-cavity surface-emitting lasers, polymeric hologram grating couplers, and metal-semiconductor-metal photodetectors. As a preliminary experiment, we show the feasibility of board-to-board level substrate-guided wave optoelectronic interconnections in the real electrical system. First, we introduce a new architecture - centralized optical backplane - for board-to-board level interconnections. Second, the optoelectronic data channel is constructed compatible with standard PECL and capable of operating at 1.25 Gbps. Finally, it is employed to replace the conventional electrical data channel in a microprocessor system. We describe the performance of the entire system and discuss the future application of our centralized optical backplane in other electrical systems.

引用

页码：131 / 140

页数：10