Microstructure and thermal properties of diamond/aluminum composites with TiC coating on diamond particles

被引:116
|
作者
Feng, H. [1 ]
Yu, J. K. [1 ]
Tan, W. [1 ]
机构
[1] NW Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China
基金
中国国家自然科学基金;
关键词
Composite materials; Coatings; Interfaces; Thermal properties; CONDUCTIVITY; AL; RESISTANCE;
D O I
10.1016/j.matchemphys.2010.08.003
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A titanium carbide coating on the surface of diamond particles was proposed to improve the interfacial bonding between diamond particles and aluminum alloy for diamond/aluminum composites. The diamond/aluminum composites with the TiC coating on diamond particles were fabricated by gas pressure infiltration. The composites were characterized with optical microscope and scanning electron microscopy and by measuring thermal properties, including thermal conductivity and coefficient of thermal expansion. The results show that the interface adhesion between the diamond particles and the aluminum matrix is strengthened due to the existence of the TiC coating, and the fracture mechanism of the composites is a combination of matrix's ductile fracture and interfacial debonding. Improvements in thermal properties, including a reduced thermal expansion and a high thermal conductivity, have been achieved by the TiC coating on diamond particles to get the good interface. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:851 / 855
页数:5
相关论文
共 50 条
  • [1] Microstructure and thermal properties of copper-diamond composites with tungsten carbide coating on diamond particles
    Kang, Qiping
    He, Xinbo
    Ren, Shubin
    Liu, Tingting
    Liu, Qian
    Wu, Mao
    Qu, Xuanhui
    MATERIALS CHARACTERIZATION, 2015, 105 : 18 - 23
  • [2] Effect of Nano-SiC coating on the thermal properties and microstructure of diamond/Al composites
    Dong, Z. Y.
    Liu, X. Y.
    Wang, D.
    Wang, W. G.
    Xiao, B. L.
    Ma, Z. Y.
    COMPOSITES COMMUNICATIONS, 2023, 40
  • [3] Thermal properties of diamond/Cu composites enhanced by TiC plating with molten salts containing fluoride and electroless-plated Cu on diamond particles
    Li, Hongwei
    Xie, Yueyang
    Zhang, Liqi
    Wang, Huina
    DIAMOND AND RELATED MATERIALS, 2022, 129
  • [4] Diamond/aluminum composites processed by vacuum hot pressing: Microstructure characteristics and thermal properties
    Tan, Zhanqiu
    Li, Zhiqiang
    Fan, Genlian
    Kai, Xizhou
    Ji, Gang
    Zhang, Lanting
    Zhang, Di
    DIAMOND AND RELATED MATERIALS, 2013, 31 : 1 - 5
  • [5] Effect of nanometer TiC coated diamond on the strength and thermal conductivity of diamond/Al composites
    Liu, X. Y.
    Wang, W. G.
    Wang, D.
    Ni, D. R.
    Chen, L. Q.
    Ma, Z. Y.
    MATERIALS CHEMISTRY AND PHYSICS, 2016, 182 : 256 - 262
  • [6] Thermal conductivity of TiC-coated diamond/Al composites
    Xue, C.
    Yu, J. K.
    EMERGING MATERIALS RESEARCH, 2012, 1 (02) : 99 - 105
  • [7] Microstructure and thermal properties of diamond/copper composites with Mo2C in-situ nano-coating
    Liu, Ruxia
    Luo, Guoqiang
    Li, Yuan
    Zhang, Jian
    Shen, Qiang
    Zhang, Lianmeng
    SURFACE & COATINGS TECHNOLOGY, 2019, 360 : 376 - 381
  • [8] Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy
    Ren, Shubin
    Shen, Xiaoyu
    Guo, Caiyu
    Liu, Nan
    Zang, Jianbing
    He, Xinbo
    Qu, Xuanhui
    COMPOSITES SCIENCE AND TECHNOLOGY, 2011, 71 (13) : 1550 - 1555
  • [9] Fabrication of diamond/aluminum composites by vacuum hot pressing: Process optimization and thermal properties
    Tan, Zhanqiu
    Li, Zhiqiang
    Fan, Genlian
    Kai, Xizhou
    Ji, Gang
    Zhang, Lanting
    Zhang, Di
    COMPOSITES PART B-ENGINEERING, 2013, 47 : 173 - 180
  • [10] Effects of boron on the microstructure and thermal properties of Cu/diamond composites prepared by pressure infiltration
    Fan, Ye-ming
    Guo, Hong
    Xu, Jun
    Chu, Ke
    Zhu, Xue-xin
    Jia, Cheng-chang
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2011, 18 (04) : 472 - 478