A Fully integrated D-band Direct-Conversion I/Q Transmitter and Receiver Chipset in SiGe BiCMOS Technology

被引:10
|
作者
Carpenter, Sona [1 ]
Zirath, Herbert [2 ]
He, Zhongxia Simon [2 ]
Bao, Mingquan [3 ]
机构
[1] Sivers Semicond AB, Kista, Sweden
[2] Chalmers Univ Technol, Dept Microtechnol & Nanosci, MC2, S-41296 Gothenburg, Sweden
[3] Ericsson AB, Ericsson Res, Device & EMF, Microwave Syst RadioAccess Hardware, Gothenburg, Sweden
关键词
Demodulator; direct conversion; I/Q transceiver; low noise amplifier; measurement; millimeter wave integrated circuits; mixer; modulator; multiplier; MMICs; power amplifier; wireless communication; MODULATOR;
D O I
10.23919/JCN.2021.000010
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This paper presents design and characterization of single-chip 110-170 GHz (D-band) direct conversion in-phase/quadrature-phase (I/Q) transmitter and receiver monolithic microwave integrated circuits (MMICs), realized in a 130 nm SiGe BiCMOS process with ft/fmax of 250 GHz/370 GHz. The chipset is suitable for low power wideband communication and can be used in both homodyne and heterodyne architectures. The Transmitter chip consists of a six-stage power amplifier, an I/Q modulator, and a LO multiplier chain. The LO multiplier chain consists of frequency sixtupler followed by a two-stage amplifier. It exhibits a single sideband conversion gain of 23 dB and saturated output power of 0 dBm. The 3 dB RF bandwidth is 31 GHz from 114 to 145 GHz. The receiver includes a low noise amplifier, I/Q demodulator and x6 multiplier chain at the LO port. The receiver provides a conversion gain of 27 dB and has a noise figure of 10 dB. It has 3 dB RF bandwidth of 28 GHz from 112-140 GHz. The transmitter and receiver have dc power consumption of 240 mW and 280 mW, respectively. The chip area of each transmitter and receiver circuit is 1.4 mm x 1.1 mm.
引用
收藏
页码:73 / 82
页数:10
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