The interfacial analysis of a film bonded to a finite thickness graded substrate

被引：32

作者：

Chen, Peijian ^{[1
]}

Peng, Juan ^{[1
]}

Yu, Liyuan ^{[1
]}

Yang, Yugui ^{[1
]}

机构：

[1] China Univ Min & Technol, Sch Phys, Sch Mech & Civil Engn, State Key Lab Geomech & Deep Underground Engn, Xuzhou 221116, Jiangsu, Peoples R China

来源：

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES | 2017年 / 120卷

关键词：

Bonded problem; Loading condition; Stress intensity factor; Film/substrate system; THIN-FILM; CONTACT MECHANICS; COATING/SUBSTRATE SYSTEM; HALF-PLANE; BEHAVIOR; EDGE; STRESS; PUNCH; DEFLECTION; CRACKING;

D O I：

10.1016/j.ijsolstr.2017.04.029

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

The problem of an elastic film bonded to a finite-thickness graded substrate under different loading conditions is investigated, in which the shear modulus of the graded substrate is assumed to vary exponentially along its thickness and perfect adhesion is adopted at the contact interface. The governing singular integral equation for the present model is formulated analytically in terms of interfacial shear stress. With the help of the collocation method, the governing equation is further solved numerically. The interfacial shear stress, the normal stress in the film as well as the singularity near the film edges are discussed in order to evaluate the interface behaviors that are closely related to failure and destruction of the film/substrate systems. It is found that the interface behavior of the film/substrate system can be modified by tuning the material and geometric parameters of both the film and the graded substrate. Compared with cases under a non-symmetric loading and a symmetric one, the effect of some parameters is observed to be dependent of the loading type. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：57 / 66

页数：10

共 42 条

[1] THE EDGE CRACKING AND DECOHESION OF THIN-FILMS [J].

AKISANYA, AR ;

FLECK, NA .

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1994, 31 (23) :3175-3199

[2] On the interface debond at the edge of a thin film on a thick substrate [J].

Alaca, BE ;

Saif, MTA ;

Sehitoglu, H .

ACTA MATERIALIA, 2002, 50 (05) :1197-1209

[3]

[Anonymous], 1980, CONTACT PROBLEMS CLA, DOI [10.1007/978-94-009-9127-9, DOI 10.1007/978-94-009-9127-9]

[4]

ARUTIUNIAN NK, 1968, PMM-J APPL MATH MEC+, V32, P652

[5] Contractile Stresses in Cohesive Cell Layers on Finite-Thickness Substrates [J].

Banerjee, Shiladitya ;

Marchetti, M. Cristina .

PHYSICAL REVIEW LETTERS, 2012, 109 (10)

[6] THE BEHAVIOR OF AN ELASTIC NON-HOMOGENEOUS HALF-SPACE .1. LINE AND POINT LOADS [J].

BOOKER, JR ;

BALAAM, NP ;

DAVIS, EH .

INTERNATIONAL JOURNAL FOR NUMERICAL AND ANALYTICAL METHODS IN GEOMECHANICS, 1985, 9 (04) :353-367

[7] Interface behavior of a thin-film bonded to a graded layer coated elastic half-plane [J].

Chen, Peijian ;

Chen, Shaohua ;

Peng, Juan .

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2016, 115 :489-500

[8] Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate [J].

Chen Peijian ;

Chen Shaohua ;

Yao Yin .

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2016, 83 (02)

[9] Sliding Contact Between a Cylindrical Punch and a Graded Half-Plane With an Arbitrary Gradient Direction [J].

Chen Peijian ;

Chen Shaohua ;

Peng Juan .

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2015, 82 (04)

[10] Partial slip contact between a rigid punch with an arbitrary tip-shape and an elastic graded solid with a finite thickness [J].

Chen, Peijian ;

Chen, Shaohua .

MECHANICS OF MATERIALS, 2013, 59 :24-35

← 1 2 3 4 5 →